Mirra MESA CMP 200mm Contour Head

APPLICATIONS
•	200mm Planarization Contour head
•	Apply for Silicon, shallow trench isolation (STI), oxide polysilicon,  tungsten and copper damascene applications

FEATURES & BENEFITS
•	High speed planarizing platens
•	Multi-zone polishing heads available ( 1~4 Zones)
•	Superior uniformity & efficiency with low downforce.